Lub Dimensity CPU tshiab uas Redmi K50 Pro yuav siv yuav qhia tag kis!

Lu Weibing tau tshaj tawm cov lus piav qhia tias qhov tshiab ntawm MediaTek Dimensity yuav raug tso tawm, nrog rau lub xov tooj yuav los sai sai.

Raws li koj paub, MWC 2022 pib thaum Lub Ob Hlis 22 thiab yuav kav mus txog Lub Peb Hlis 3. Lub sijhawm no, ntau lub tuam txhab smartphone tau tshaj tawm lawv cov khoom tshiab. Cov khoom tshiab yuav tshwm sim los ntawm MediaTek. Tshiab MediaTek CPUs yuav tshaj tawm tag kis.

Dimensity raws li tshiab Redmi yuav tshaj tawm tag kis

Cov ntawv tshaj tawm no, sib koom los ntawm MediaTek nplooj ntawv nom thiab rov tshaj tawm los ntawm Lu Weibing, tej zaum yog Dimensity 8100 qauv.

Raws li tau hais ua ntej, Redmi yuav yog ib lub npe thawj zaug los qhia cov chipset hauv qab no hauv lawv lub xov tooj smartphone. Txhawm rau muab koj lub tswv yim txog nws qhov kev ua tau zoo, Dimensity 9000 yog siv los ntawm 1X Cortex X2 clocked ntawm 3.2Ghz, 3X Arm Cortex-A710 clocked ntawm 2.85GHz, 4X Arm Cortex-A510 clocked ntawm 1.8Ghz thiab nws kuj muaj MP710 G10 GPU . Cov lus qhia tshwj xeeb ntawm Dimensity 9000 yog qhov muaj zog dua me ntsis piv rau Dimensity 8100.

MediaTek Dimensity 8100 ua nrog 5nm tsim tshuab, lub processor nta 4 Cortex A78 kev ua haujlwm cores, 4 Cortex A55 lub zog txuag cores. Lub MediaTek Dimenstiy 8100 siv Mali G610 MC6 graphics unit. Yog tias peb saib ntawm qhov tshwj xeeb ntawm Dimensity 8100, nws yuav xa cov kev ua tau zoo sib xws nrog Qualcomm Snapdragon 888 chipset.

 

lwm yam khoom