Mobile World Congress (MWC 2023), uas tau tuav txhua xyoo, tau pib thaum Lub Ob Hlis 27th thiab txuas ntxiv mus txog Lub Peb Hlis 2nd. Ntau lub tuam txhab tau qhia lawv cov khoom tshiab ntawm kev ncaj ncees. Xiaomi tus tshiab flagship qauv, lub Xiaomi 13 thiab xiaomi 13 pro, nrog rau lawv cov khoom siv, tau ntxim nyiam ntawm cov neeg tuaj saib ntawm kev ncaj ncees.
Qualcomm thiab Thales nthuav tawm lub ntiaj teb thawj GSMA-raws li iSIM thev naus laus zis ntawm MWC 2023 thiab tshaj tawm tias nws tau sib xws nrog Snapdragon 8 Gen 2 mobile platform. Lub ntsiab lus "iSIM" sawv cev rau "Integrated SIM". Nws xav tias yuav hloov pauv Embedded SIM (eSIM) thev naus laus zis, uas tau dhau los ua neeg nyiam nyob rau xyoo tas los no.
Qhov zoo ntawm iSIM
iSIM muaj cov cuab yeej zoo sib xws rau eSIM. Txawm li cas los xij, qhov zoo tshaj plaws ntawm iSIM yog tias nws yog kev daws teeb meem ntau dua. Cov khoom tsim nyog rau eSIM thev naus laus zis siv qhov chaw hauv smartphones. iSIM, ntawm qhov tod tes, tshem tawm cov khoom clutter tsim los ntawm eSIM los ntawm muab tso rau hauv lub chipset. Tsis tas li ntawd, vim tias tsis muaj cov khoom ntxiv ntawm lub motherboard ntawm lub xov tooj, cov tuam ntxhab tuaj yeem txo cov nqi tsim khoom. Tsis tas li ntawd, cov tuam txhab lag luam tuaj yeem rov ua qhov chaw seem los ntawm kev txav deb ntawm eSIM thiab siv cov cuab yeej tshiab no rau lwm cov khoom xws li lub roj teeb loj dua lossis cov cua txias zoo dua.
Txawm hais tias Integrated SIM technology yuav tsis siv rau hauv cov khoom siv tshiab hauv lub sijhawm luv luv, nws tau kwv yees tias thawj lub xov tooj smartphones siv iSIM yuav muaj nyob rau hauv Q2 2023. yav tom ntej, Xiaomi smartphones siv. Snapdragon 8 Gen2 tuaj yeem suav nrog qhov no.
