Mobile World Congress (MWC 2023), yomwe imachitika chaka chilichonse, idayamba pa February 27 ndikupitilira mpaka pa Marichi 2. Opanga ambiri adabweretsa zatsopano zawo pachiwonetserocho. Mitundu yatsopano ya Xiaomi, the Xiaomi 13 ndi xiaomi 13 pro, komanso zida zawo, adakopa chidwi cha alendo pachiwonetserocho.
Qualcomm ndi Thales adavumbulutsa ukadaulo woyamba wapadziko lonse wa iSIM wogwirizana ndi GSMA pa MWC 2023 ndipo adalengeza kuti ikugwirizana ndi nsanja yam'manja ya Snapdragon 8 Gen 2. Mawu akuti "iSIM" amaimira "Integrated SIM". Akuyembekezeka kulowa m'malo mwaukadaulo wa Embedded SIM (eSIM), womwe wadziwika kwambiri m'zaka zaposachedwa.
Ubwino wa iSIM
iSIM ili ndi ukadaulo wofanana ndi eSIM. Komabe, mwayi waukulu wa iSIM ndikuti ndi njira yotsika mtengo kwambiri. Zomwe zimafunikira paukadaulo wa eSIM zimatenga malo mkati mwa mafoni. ISIM, kumbali ina, imachotsa zinthu zomwe zimapangidwa ndi eSIM poyikidwa mkati mwa chipset. Kuphatikiza apo, popeza palibe chowonjezera pa bolodi la foni yam'manja, opanga amatha kuchepetsa ndalama zopangira. Kuphatikiza apo, opanga amatha kubwezanso malo omwe adatsalira pochoka ku eSIM ndikugwiritsa ntchito ukadaulo watsopanowu pazinthu zina monga batire yayikulu kapena makina ozizirira bwino.
Ngakhale ukadaulo wa Integrated SIM sungagwiritsidwe ntchito pazida zatsopano kwakanthawi kochepa, akuti mafoni oyamba omwe amagwiritsa ntchito iSIM adzakhalapo mu Q2 2023. M'tsogolomu, mafoni a Xiaomi akugwiritsa ntchito Snapdragon 8 Gen2 zitha kuphatikiza izi.
