Oppo Fumana X7 e phahamisitse boemo ba benchmark ba AnTuTu hape ka Hlakola. Smartphone, e tsamaisoang ke Dimensity 9300, e tsoetse pele ho feta mefuta e metle ea lihlahisoa tse tsoang lihlahisoa tse ling, ho kenyeletsoa ASUS ROG 8 Pro, iQOO 12, RedMagic 9 Pro+, vivo X100 Pro, le tse ling.
Ha se litaba tse kholo tse makatsang joalo ka Oppo fumana X7 e boetse e laola maemo khoeling e fetileng. Leha lintlha tsa eona li theohile khoeling ena, e ntse e khona ho boloka boemo bo holimo, ka lebaka la Dimensity 9300.
Bakeng sa MediaTek, leha ho le joalo, ke ts'ebetso e makatsang, e fuoeng taolo ea Qualcomm nakong e fetileng. Khampani ea Taiwanese fabless semiconductor e bonts'itse ntlafatso e kholo ea ho fumana Qualcomm likhoeling tse fetileng, e lumella tse ling tsa li-smartphone tseo e ntseng e li fa matla ho feta bahlolisani. Ho latela litlhahlobo le liteko, MediaTek's Dimensity 9300 e na le lintlha tse phahameng tsa 10% tse phahameng ho feta Snapdragon 8 Gen 1, athe lintlha tsa eona tsa mantlha tse ngata li ka bapisoa le A14 Bionic.
Boemong ba morao-rao ba AnTuTu, Dimensity 9300 e tsoetse pele ho feta Snapdragon 8 Gen 3, leha e le ka karolo e nyane. Leha ho le joalo, joalo ka ha ho boletsoe pejana, ho latela botumo ba Qualcomm indastering, MediaTek ho phahamisa boemo hoa khahla kaha e fana ka maikutlo a ho qala tlholisano e betere lipakeng tsa lik'hamphani tsena tse peli.
Ena e tla be e le khoeli ea bobeli Oppo Fumana X7 e fumane sebaka, empa e ka fetoha haufinyane. Kamora ho lokolla ROG 8 Pro ka Pherekhong, ASUS e lebelletsoe ho lokolla mofuta oa D oa smartphone e boletsoeng ea ROG e sebelisa chip ea MediaTek. Kahoo, ka lipalo tse nyane tse arolang Oppo Fumana X7 le ASUS ROG 8 Pro, boemo bo ka bona liphetoho haufinyane.
