Kajeno, processor e ncha ea li-flagship Snapdragon 8 Gen 2 e hlahisitsoe ketsahalong ea Snapdragon TechSummit 2022. Qualcomm e ntse e tsoela pele ho ba pula-maliboho ea pele ka chipset ena. Bekeng e fetileng, ho ile ha qalisoa sebapali se secha sa MediaTek, Dimensity 9200. Ka lekhetlo la pele, re kopane le likarolo tse ncha tse kang li-CPU cores tsa morao-rao tse thehiloeng ho Arm's V9 ea Arm, theknoloji e thehiloeng ho ray tracing le Wifi-7 ka chip. Snapdragon 8 Gen 2 ha e salletse morao ho mohanyetsi oa eona, Dimensity 9200. E na le likarolo tse tšoanang tsa bopula-maliboho. Ho boetse ho boleloa hore e ntlafalitsoe haholo ka lehlakoreng la ISP. Ntle le ho feta, a re keneng ka botebo ka har'a chipset e ncha.
Qualcomm Snapdragon 8 Gen 2 Litlhaloso
Snapdragon 8 Gen 2 e ea makatsa. E tla matlafatsa li-smartphones tse ncha tsa li-flagship tsa 2023. Mefuta e mengata e tiisitse hore e tla hlahisa mehlala ea eona e sebelisa mochine ona qetellong ea selemo. Qualcomm e bitsa "tlhahiso ea bohlale ba maiketsetso" SOC, e tla sebelisoa ke lihlahisoa tse kang ASUS ROG, HONOR, iQOO, Motorola, nubia, OnePlus, Oppo, RedMagic, Redmi, Sharp, Sony, Vivo, Xiaomi, XINGJI/MEIZU, le ZTE. Ena ke tsoelo-pele e thabisang.
Snapdragon 8 Gen 2 e na le octa-core CPU setup e ka fihlang 3.2GHz. Ntho ea mantlha ea ts'ebetso e feteletseng e ncha 3.2GHz Cortex-X3 e entsoeng ke ARM. Li-cores tse thusang li bonoa e le 2.8GHz Cortex-A715 le 2.0GHz Cortex-A510. Ha ho bapisoa le li-chips tsa pele tsa Qualcomm, ho na le keketseho ea lebelo la oache. E etsa sena ka boemo bo phahameng TSMC 4nm+ (N4P) mokhoa oa ho etsa. Mokhoa oa ho etsa TSMC o netefalitsoe nako le nako hore o atlehile. Qualcomm e bile le mathata a itseng ka Snapdragon 8 Gen 1 ka lebaka la Samsung.
Mathata a kang tšebeliso e feteletseng ea matla, ho futhumatsa le FPS e theoha lipapaling a soetsehile basebelisi. Hamorao Qualcomm o ile a hlokomela sena. E lokolitse Snapdragon 8+ Gen 1, phetolelo e ntlafalitsoeng ea Snapdragon 8 Gen 1. Phapang ea bohlokoa ka ho fetisisa ea Snapdragon 8+ Gen 1 ke hore e hahiloe holim'a mokhoa oa tlhahiso ea TSMC. Re bone ts'ebetso ea matla le ts'ebetso e tsitsitseng hantle haholo. Snapdragon 8 Gen 2 e ncha e tsoela pele kutloisiso eo. Ho phatlalalitsoe hore ho tla ba le keketseho ea 40% ea matla a matla. MediaTek ha e so phatlalatse keketseho e phahameng joalo ea chip ea eona e ncha. Ha re bolele esale pele hore re tla hlahloba boemo ba ts'ebetso ho li-smartphones tse ncha ka botlalo.
Ka lehlakoreng la GPU, Qualcomm e boletse keketseho ea ts'ebetso ea 25% ho feta ea pele ho eona. E na le likarolo tse ncha tseo re li bonang ho bahlolisani ba eona. Tse ling tsa tsona ke hore e na le theknoloji e thehiloeng ho ray tracing ea hardware. Litšehetso tsa API li kenyelletsa OpenGl ES 3.2, OpenCL 2.0 FP le Vulkan 1.3. Qualcomm e buile ka karolo e bitsoang Snapdragon Shadow Denoiser e ncha. Karolo ena e etsa liphetoho tse ling ho meriti ea lipapali ho latela sebaka, ho latela likhakanyo tsa rona. Variable Rate Shading (VRS) e bile teng ho tloha Snapdragon 888. Leha ho le joalo, ena ke tšobotsi e fapaneng. Adreno GPU e ncha e ikemiselitse ho u fa boiphihlelo bo botle ka ho fetisisa ba papali.
Qualcomm e bua ka keketseho ea ts'ebetso ho fihlela ho ka makhetlo a 4.3 ka bohlale ba maiketsetso. Ho boleloa hore ts'ebetso ka watt e ntlafetse ka 60%. New Hexagon processor, liphetolelo tsa hang-hang li tla etsoa hamolemo. E tla nolofalletsa ts'ebetso e potlakileng ea linepe tseo u li nkileng. Ha re bua ka ho nka lifoto, re hloka ho bua ka ISP e ncha. Kamano e haufi e thehiloe le baetsi ba li-sensor. Qualcomm e entse li-tweaks tse ling ka nepo. Sensor ea pele ea 200MP e ntlafalitsoeng bakeng sa Snapdragon 8 Gen 2, Samsung ISOCELL HP3 e fana ka linepe le livideo tsa boleng bo holimo. Hape ke chipset ea pele ea Snapdragon ho ba le lisebelisoa AV1 codec, e tšehetsang ho bapala ha video ho fihla ho 8K HDR le liforeimi tse fihlang ho 60 motsotsoana. Hoa etsahala hore re tla bona a sensor e ncha ea 200MP ISOCELL HP3 letotong la Samsung's Galaxy S23.
Qetellong, ka lehlakoreng la khokahanyo, Snapdragon X70 5G Modem e senoloa. E ka fihla 10Gbps jarolla le 3.5Gbps mabelo a ho kenya. Ka lehlakoreng la wifi, ke lekhetlo la pele ho na le likarolo tsa Qualcomm chip Wifi-7 le lebelo le holimo la 5.8Gbps le fanoa. Tsena ke lintlafatso tsa bohlokoa. Re lebelletse ka thabo li-smartphones tse ncha. Ho na le basebelisi ba bangata ba batlang ho bona likarolo tsena. Seke oa tšoenyeha, joalo ka ha re hlalositse ka holimo, baetsi ba li-smartphone ba tla hlahisa lisebelisoa tsa Snapdragon 8 Gen 2 mafelong a selemo. Joale u nahana'ng ka setlamo se secha sa Snapdragon 8 Gen 2? U se ke ua lebala ho fana ka maikutlo a hau.
