U-Lu Weibing wabelane ngeposi echaza ukuba inguqulelo entsha yeMediaTek Dimensity iya kukhutshwa, kunye ne-teleon ezayo kungekudala.
Njengokuba usazi, MWC 2022 yaqala ngoFebruwari 22 kwaye iya kuhlala kude kube ngoMatshi 3. Okwangoku, abaninzi abavelisi be-smartphone kufuneka baqalise iimveliso zabo ezintsha. Iimveliso ezintsha ziya kuvela kwiMediaTek. Ii-CPU ezintsha zeMediaTek ziya kusungulwa ngomso.
Esi sithuba, ekwabelwana ngaso kwiphepha elisemthethweni leMediaTek kwaye liphinde lithunyelwe nguLu Weibing, mhlawumbi imodeli ye-Dimensity 8100.
Njengoko bekutshiwo ngaphambili, iRedmi iya kuba yenye yeebrendi zokuqala ukwazisa le chipset ilandelayo kwi-smartphone yabo. Ukukunika uluvo malunga nokusebenza kwayo, i-Dimensity 9000 inikwe amandla yi-1X Cortex X2 evalwe kwi-3.2Ghz, i-3X Arm Cortex-A710 ivalwe kwi-2.85GHz, i-4X Arm Cortex-A510 ivalwe kwi-1.8Ghz kwaye ikwane-MP710 G10 GPU9000 . Iinkcukacha kuDimensity 8100 unamandla kancinci xa kuthelekiswa noDimensity XNUMX.
I-MediaTek Dimensity 8100 eyakhelwe ngeteknoloji yokuvelisa i-5nm, iprosesa ine-4 Cortex A78 cores yokusebenza, i-4 Cortex A55 yokugcina amandla. I-MediaTek Dimenstiy 8100 isebenzisa iyunithi yemizobo ye-Mali G610 MC6. Ukuba sijonga kwiinkcukacha zeDimensity 8100, iya kuhambisa ukusebenza okufanayo kunye ne-Qualcomm Snapdragon 888 chipset.
