U-Lu Weibing wabelane ngokuthunyelwe echaza ukuthi inguqulo entsha ye-MediaTek Dimensity izokhishwa, kanye ne-teleon ezayo maduze.
Njengokwazi kwakho, MWC 2022 iqale ngoFebhuwari 22 futhi izohlala kuze kube ngoMashi 3. Okwamanje, abakhiqizi abaningi be-smartphone bazokwethula imikhiqizo yabo emisha. Imikhiqizo emisha izovela kwaMediaTek. Ama-CPU amasha eMediaTek azokwethulwa kusasa.
Lokhu okuthunyelwe, okwabiwe yikhasi elisemthethweni leMediaTek futhi kwaphinde kwathunyelwa uLu Weibing, mhlawumbe imodeli ye-Dimensity 8100.
Njengoba kushiwo ngaphambili, iRedmi izoba ngolunye lwemikhiqizo yokuqala ukwethula i-chipset elandelayo ku-smartphone yabo. Ukukunikeza umbono mayelana nokusebenza kwayo, i-Dimensity 9000 inikwa amandla yi-1X Cortex X2 evalwe ku-3.2Ghz, i-3X Arm Cortex-A710 ivalwe ku-2.85GHz, i-4X Arm Cortex-A510 ivalwe ku-1.8Ghz kanti futhi ine-MP710 G10 GPU9000 . Ukucaciswa kwe-Dimensity 8100 kunamandla kancane uma kuqhathaniswa ne-Dimensity XNUMX.
I-MediaTek Dimensity 8100 eyakhiwe ngobuchwepheshe bokukhiqiza be-5nm, iphrosesa ihlanganisa ama-cores performance cores angu-4 Cortex A78, 4 Cortex A55 power saving cores. I-MediaTek Dimenstiy 8100 isebenzisa iyunithi yezithombe ze-Mali G610 MC6. Uma sibheka ukucaciswa kwe-Dimensity 8100, izoletha ukusebenza okufanayo ne-Qualcomm Snapdragon 888 chipset.
