Uma ucabanga ngobuchwepheshe bokugcina izinto, into yokuqala ezofika engqondweni yakho kuzoba ama-SSD, adume kakhulu eminyakeni yamuva. Kodwa kuthiwani uma kufana namafoni? Kunjalo, yonke i-smartphone/ithebhulethi idinga iyunithi yokugcina. Kodwa ingabe iyunithi yokugcina iyafana kuwo wonke amafoni? Njengama-HDD amadala nama-SSD amasha, ingabe ukhona umehluko wejubane?
Evolution of Storage Technologies
Yiqiniso, kunomehluko wejubane phakathi kwamayunithi okugcina amafoni. Ngokuhamba kweminyaka, ukuthuthukiswa kobuchwepheshe kusinikeze amayunithi okugcina athuthuke kakhulu kanye nesivinini sokufunda/sokubhala esiphezulu. Khona-ke ake sihlole ubuchwepheshe bokugcina obusetshenziswa kumadivayisi e-Android kanye nokuthuthuka kwawo ngendlela yokulandelana kwezikhathi.
I-eMMC - Ubuchwepheshe bokuqala bokugcina i-Smartphone
Uhlobo lokuqala lobuchwepheshe bokugcina obusetshenziswa kuma-smartphones i-EMMC. Ubukhona bobuchwepheshe be-EMMC, obudala impela, budala kakhulu kunama-smartphones okuqala. Izinga lokuqala le-eMMC lathuthukiswa yi-JEDEC kanye ne-MultiMediaCard Association ngo-2006. I-EMMC (embedded-MMC) inguqulo eshumekiwe yezinga lememori yekhadi lemidiya eminingi (MMC).
I-eMMC isebenza njengesitoreji esiyinhloko samadivayisi aphathekayo njengama-smartphone noma amathebulethi. Izakhiwo ze-eMMC zihluke ngokusobala kwezinye izinguqulo ze-MMC. Ngoba iyisengezo esingunaphakade ku-chipset, hhayi ikhadi elikhishwa umsebenzisi. Ngakho-ke esimweni senkumbulo noma inkinga yesilawuli, i-PCB (ibhodi lesekethe eliphrintiwe) idinga ukushintshwa noma ukulungiswa.
Uma sikhuluma ngomthamo wokugcina eMMC, ngo-2009 umthamo we-EMMC ojwayelekile wawusuka ku-2GB kuya ku-8GB. Futhi ngo-2014, isilinganiso somthamo we-EMMC sifinyelele ku-32GB nangaphezulu, umthamo wamanje omkhulu ungu-128GB. Ubuchwephesha obudala, ubukhulu obuphezulu abufinyelelwanga, njengoba buthathelwe indawo obusha.
Izivinini zokufunda nokubhala ziyahlukahluka ngezinguqulo ze-EMMC. Iphrothokholi yokuqala ye-eMMC eyayisetshenziswa kuma-smartphone kwakuyi-EMMC 4.5. I-chipset ye-Qualcomm's Snapdragon 800 (MSM8974-AB) ibhekwa njengenye yama-chipsets okuqala ukusebenzisa i-EMMC 4.5. I-Mi 3 (cancro) iyidivayisi yokuqala yokusebenzisa le chipset nobuchwepheshe bokugcina ohlangothini lwe-Xiaomi. I-eMMC 4.5 inokufundwa okungu-140MB/s kanye nesivinini sokubhala esingu-50MB/s. Lokho kushesha kakhulu kune-HDD.
Kwabe sekwethulwa uhlobo lwayo olusha, i-EMMC 5.0. Lobu buchwepheshe bokugcina, obethulwa okokuqala kubasebenzisi nge-chipset ye-Snapdragon 801, bushesha kakhulu kunangaphambili, bufinyelela ku-250MB/s yokufunda kanye nesivinini sokubhala esingu-90MB/s. Empeleni, lona umehluko phakathi kwe-Snapdragon 800 ne-Snapdragon 801. I-chipset ebuyekeziwe ye-Snapdragon 800 (MSM8974-AB) enenguqulo entsha ye-eMMC yethulwe kabusha njenge-Snapdragon 801 (MSM8974-AC).
Ngokufanayo, idivayisi ye-Xiaomi ye-Mi 3, eyabuyekezwa nge-chipset entsha ne-eMMC entsha, yethulwa kabusha njenge-Mi 4 LTE. I-Mi 4 LTE, idivayisi yokuqala ye-Xiaomi esebenzisa i-EMMC 5.0, futhi iyidivayisi yokuqala ye-LTE ye-Xiaomi. Okunye ukucaciswa kwedivayisi kuyatholakala lapha. Futhi i-EMMC 5.1 inguqulo yokugcina yalobu buchwepheshe bokugcina.
Inguqulo yakamuva ye-eMMC ithi eMMC 5.1. Umehluko enguqulweni eyandulele ukukhuphuka kwesivinini sokubhala. I-eMMC 5.1 inesivinini sokufunda esingu-250MB/s kanye nesivinini sokubhala esingu-125MB/s, icishe isheshe njenge-SSD. Iphrothokholi ye-eMMC 5.1 iwubuchwepheshe bokugcina bokugcina ngoba ithathelwe indawo ubuchwepheshe bokugcina amandla obusheshayo nobukhudlwana, i-UFS!
I-UFS - Inkathi Entsha ku-Smartphone Storage Technologies
Ukudalwa kwe-UFS kuqale ngo-2010, kodwa yethulwa ngama-smartphones ngo-2015, ngokukhishwa kwe-UFS 2.0. Njenge-EMMC, i-UFS isebenzisa i-NAND flash. Kakade i-UFS isibekwe esikhundleni sokuvala i-EMMCs namakhadi e-SD. I-UFS inomkhawulokudonsa ophezulu kune-interface ye-eMMCs ye-8-lane parallel kanye nesigamu-duplex. Futhi ngokungafani ne-EMMC, isuselwe kumodeli yezakhiwo ze-SCSI. Ngamafuphi, ibithuthuke kakhulu futhi inesivinini sokufunda/sokubhala esiphezulu kune-EMMC.
NgoFebhuwari 2013, inkampani ye-semiconductor ye-Toshiba Memory (okwamanje i-Kioxia) yaqala ukuthumela amasampula e-flash chip engu-64GB NAND, okwakuyi-chip yokuqala ukusekela izinga le-UFS ngaleso sikhathi. Ngo-Ephreli 2015, uchungechunge lwe-Samsung Galaxy S6 lukhishwe njengamafoni okuqala ukusebenzisa i-UFS 2.0 ejwayelekile.
Vele, i-Xiaomi bekuyinkampani elandela intuthuko. Amadivayisi alandelayo e-Xiaomi, uchungechunge lwe-Mi 5 lweza nobuchwepheshe bokugcina be-UFS 2.0. Lokhu ukweleta i-Qualcomm Snapdragon 820 (MSM8996) chipset. I-UFS 2.0 yayinesivinini sokufunda esingu-350MB/s kanye nesivinini sokubhala esingu-150MB/s.
Kamuva ngoNovemba 17, 2016, iQualcomm yamemezela i-chipset ye-Snapdragon 835 (MSM8998) ene-UFS 2.1. Le chipset, eza ne-UFS 2.1 ethuthuke kakhulu, yayinesivinini esikhulu kakhulu sokufunda/sokubhala kunesandulelayo. Idivayisi yokuqala ukuba nale Mi 6 ohlangothini lwe-Xiaomi. I-UFS 2.1 ikwazile ukufinyelela isivinini sokufunda esingu-860 MB/s kanye nesivinini sokubhala esingu-250 MB/s. Lezi zivinini zokufunda/zokubhala, eziye zanda ngokuhamba kwesikhathi, ziholele kumadivayisi okusebenza kwangempela emakethe ye-Android.
Ubuchwepheshe bokugcina be-UFS, manje osebuqale ngempela ukuthuthuka futhi buqhubeka nendlela yabo nge-UFS 3.0. Le protocol, eza ne-chipset ye-Qualcomm Snapdragon 865 (SM8250), ihlangane nabasebenzisi ngokuphromotha okugomelayo ngabakwaSamsung noXiaomi. Uchungechunge lwe-Samsung Galaxy S20 olwethulwa ngoFebhuwari 11, 2020 kanye nochungechunge lwe-Xiaomi Mi 10 olwethulwa ngoFebhuwari 13, 2020. Zombili uchungechunge lwamadivayisi zinabo lobu buchwepheshe bokugcina. I-UFS 3.0 inesivinini sokufunda esikhulu esingafika ku-2100 MB/s kanye nesivinini sokubhala esingu-410 MB/s. Kukhulu ukugxumela phambili uma kuqhathaniswa nokwandulelayo.
Inguqulo yamanje ye-UFS yi-UFS 3.1. Ubuchwepheshe bakamuva bokugcina bufika ne-Qualcomm Snapdragon 865+, Snapdragon 888 kanye nama-chipset angemuva, asasetshenziswa nanamuhla. Umehluko obaluleke kakhulu we-UFS 3.1 ukwanda okukhulu kwejubane lokubhala. Ifinyelela isivinini sokufunda esingu-2100MB/s njenge-UFS 3.0, kodwa i-UFS 3.1 inesivinini esingavamile sokubhala esingu-1200MB/s. Ngokushesha kunama-SSD amaningi namuhla. I-Xiaomi iphinde yasetshenziswa okokuqala ochungechungeni lwe-Mi 10T. Namuhla, isiphenduke indinganiso yamadivayisi aphakathi nendawo.
I-NVMe - Imfihlo Yejubane le-iPhone
I-NVMe ibhekisela kubuchwepheshe bokugcina besizukulwane esilandelayo. Uma ucabanga nge-NVMe esetshenziswa kumakhompyutha anamuhla, ukuqagele kahle. I-NVMe ingeyamadivayisi we-iPhone ukuthi iyini i-UFS kumadivayisi we-Android. Kepha ngokungafani ne-Android UFS, i-NVMe kumadivayisi e-iPhone ithuthuke kakhulu njengoba iyisitoreji sekhompiyutha esehlisiwe ngandlela thile ngokungafani ne-UFS esekwe kuselula. Ngokungafani ne-UFS 3.1, NVMe, i-Apple ilungiswe ngokuphelele kulobu buchwepheshe, obunikeza isikhathi sokuphendula esisheshayo samadivayisi ayo. Ngamafuphi, i-UFS ebanzi esetshenziswa kumadivayisi we-Android, i-NVMe eqondene ne-iPhone eyengeziwe.
Kokubili i-UFS ne-NVMe kungamadivayisi okugcina; ngakho-ke, inama-dynamics aseduze uma kuziwa ekukhiqizeni. Kodwa kuthathe i-Apple isikhathi ukuyithuthukisa. Amadivayisi we-Pre-iPhone 11 ayengaphansi kakhulu kwejubane le-UFS 2.1. I-Apple ikwazile ukubamba lo mfutho kumadivayisi we-post-iPhone 11. Ngemuva kuka-2019, kwakusho ukuqala komncintiswano we-Apple.
Ubuchwepheshe bokugcina be-NVMe kudivayisi ye-iPhone 11 bunokufundwa okungu-800MB/s kanye nesivinini sokubhala esingu-500MB/s. Mayelana nesivinini sokufunda, ihambisana ne-UFS 2.1. Futhi ijubane lokubhala liqhathaniswa ne-UFS 3.0. Manje, idivayisi yakamuva ye-Apple, i-iPhone 13 Pro, inesivinini sokufunda esingu-1600MB/s kanye nesivinini sokubhala esingu-1000MB/s, siqhudelana ne-UFS 3.1. Okunye ukucaciswa kwe-iPhone 13 Pro lapha.
Ukuqhathanisa Ubuchwepheshe Besitoreji
Songa yonke i-athikili ndawonye, ukuqhathanisa okubanzi kungenziwa, kusukela ekukhishweni kokuqala kwe-eMMC kuya kuzivinini zanamuhla ze-UFS 3.1 ne-NVMe. Ngale ndlela, ukuthuthukiswa kobuchwepheshe bokugcina kuzoqondwa kangcono.
| Iyunithi Yesitoreji | I-Sequential Read (MB / s) | Ukubhala okulandelanayo (MB / s) |
|---|---|---|
| eMMC 4.5 | I-140 MB / s | I-50 MB / s |
| eMMC 5.0 | I-250 MB / s | I-90 MB / s |
| eMMC 5.1 | I-250 MB / s | I-125 MB / s |
| I-UFS 2.0 | I-350 MB / s | I-150 MB / s |
| I-UFS 2.1 | I-860 MB / s | I-250 MB / s |
| I-UFS 3.0 | I-2100 MB / s | I-410 MB / s |
| I-Apple NVMe | I-1800 MB / s | I-1100 MB / s |
| I-UFS 3.1 | I-2100 MB / s | I-1200 MB / s |
Ubuchwepheshe bokugcina obuthuthukile kusukela esikhathini esidlule kuze kube manje bukulesi simo. Nakuba i-NVMe ibambeke phakathi kwe-UFS 3.0 ne-UFS 3.1, ukusebenza komsebenzisi kungase kuhluke kuye ngokusimama kwedivayisi. Ama-Smartphones, afinyelele isivinini esinzima se-EMMC kuya esivinini esikhulu se-UFS, azofinyelela isivinini esikhulu ngokuzayo, i-UFS 4.0 ingaba ubufakazi balokho. Ngakho-ke, hlala ubukele ukuze uhlale unolwazi lwakamuva ngentuthuko.
